| 000 | 00947 a2200277 4500 | ||
|---|---|---|---|
| 003 | UMK | ||
| 005 | 20250731092052.0 | ||
| 008 | 250731b2024 enga|||| |||| 00| 0 eng d | ||
| 020 | _a9781119179276 | ||
| 040 |
_aWaSeSS/DLC _beng _cDLC _dUMK _erda |
||
| 050 |
_aTK7870.25 _b.L86 2024 |
||
| 100 | 1 |
_aLuo, Xiaobing, _d1974- _eauthor |
|
| 245 | 1 | 0 |
_aThermal Management for Opto-Electronics Packaging and Applications / _cXiaobing Luo, Run Hu, Bin Xie |
| 264 | 1 |
_aHoboken, NJ : _bWiley, _c2024 |
|
| 264 | 4 | _c©2024 | |
| 300 |
_axxii, 345 pages : _billustrations (some color) ; _c29 cm |
||
| 336 |
_2rdacontent _atext |
||
| 337 |
_2rdamedia _aunmediated |
||
| 338 |
_2rdacarrier _avolume |
||
| 500 | _aIncludes index. | ||
| 650 | 1 | 0 |
_aElectronic apparatus and appliances _xThermal properties |
| 650 | 2 | 0 | _aOptoelectronics |
| 700 | 1 |
_aHu, Run, _c(Professor), _eauthor |
|
| 700 | 1 |
_a Xie, Bin, _c(Assistant Professor), _eauthor |
|
| 942 |
_c1 _2lcc |
||
| 999 |
_c130910 _d130910 |
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