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	1.	Advanced MEMS packaging / John H. Lau ... [et al.]. by Lau, John H Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2010 Other title: Advanced microelectromechanical systems packaging Availability: Items available for loan: UMK Kampus Jeli (2)Call number: TK7875 .A378 2010 OS, ... Place hold
	2.	Quantum-well laser array packaging : nanoscale packaging techniques Jens W. Tomm, editor, Juan Jiménez by Jiménez, J. (Juan Tomm, Jens W Series: McGraw-Hill nanoscience and technology series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c2007 Availability: Items available for reference: UMK Kampus Jeli: Not for loan (1)Call number: QC176.8.Q35 Q36 2007 REF.
	3.	MEMS/MOEMS packaging : concepts, designs, metarials, and processes / Ken Gilleo. by Gilleo, Ken Series: McGraw-Hill nanoscience and technology series Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2005 Availability: Items available for loan: UMK Kampus Bachok (1)Call number: TK7870.15 .G55 2005 OS. Place hold
	4.	Fundamentals of microsystems packaging / Rao R. Tummala, editor. by Tummala, Rao R, 1942- Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2001 Availability: Items available for reference: UMK Kampus Bachok: Not for loan (1)Call number: TK7870.15 .F86 2001 REF.
	5.	Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements / Charles Cohn, Charles A. Harper, [editors]. by Cohn, Charles Harper, Charles A Series: McGraw-Hill professional engineering Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2005 Availability: Items available for loan: UMK Kampus Bachok (1)Call number: TK7870.15 .F353 2005 OS. Place hold
	6.	Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements / Charles Cohn, Charles A. Harper, [editors]. by Cohn, Charles Harper, Charles A Series: McGraw-Hill professional engineering Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2005 Availability: Items available for reference: UMK Kampus Bachok: Not for loan (1)Call number: TK7870.15 .F353 2005 REF.
	7.	Area array packaging handbook / Ken Gilleo. by Gilleo, Ken Series: McGraw-Hill packaging and electronics books Material type: Text; Format: print Publication details: New York : McGraw-Hill, 2002 Availability: Not available: UMK Kampus Jeli: In Transit (1).
	8.	Quantum-well laser array packaging : nanoscale packaging techniques / Jens W. Tomm, editor, Juan Jimenez, editor. by Jimenez, J. (Juan) Tomm, Jens W Series: McGraw-Hill nanoscience and technology series Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2007 Availability: Items available for loan: UMK Kampus Jeli (1)Call number: QC176.8.Q35 Q36 2007 OS. Place hold
	9.	MEMS/MOEMS packaging : concepts, designs, materials, and processes / Ken Gilleo. by Gilleo, Ken Series: McGraw-Hill nanoscience and technology series Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2005 Availability: Items available for reference: UMK Kampus Kota: Not for loan (1)Call number: TK7870.15 .G55 2005 REF.
	10.	Introduction to system-on-package (SOP) : miniaturization of the entire system / Rao R. Tummala, Madhavan Swaminathan by Tummala, Rao R, 1942- [author] Swaminathan, Madhavan [author] Material type: Text; Format: print Publisher: New York : McGraw-Hill, c2008Copyright date: c2008 Availability: Items available for loan: UMK Kampus Bachok (1)Call number: TK7870.15 .T86 2008 OS. Items available for reference: UMK Kampus Kota: Not for loan (1)Call number: TK7870.15 .T86 2008 REF. Place hold
	11.	Fundamentals of microsystems packaging / Rao R. Tummala, editor. by Tummala, Rao R, 1942- Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c2001 Availability: Items available for loan: UMK Kampus Bachok (1)Call number: TK7870.15 .F86 2001 OS. Place hold
	12.	Microwave and millimeter-wave electronic packaging / Rick Sturdivant. by Sturdivant, Rick Series: Artech House microwave library Material type: Text; Format: print ; Literary form: Not fiction Publication details: Boston : Artech House, [2014] Availability: Items available for loan: UMK Kampus Jeli (1)Call number: TK7870.15 .S78 2014. Place hold
	13.	Adhesion in microelectronics / edited by K.L. Mittal and Tanweer Ahsan. by Ahsan, Tanweer Mittal, K. L, 1945- Material type: Text; Format: print ; Literary form: Not fiction Publication details: Hoboken, New Jersey : Scrivener Publishing/Wiley, 2014 Availability: Items available for loan: UMK Kampus Jeli (1)Call number: TK7870.15 .A34 2014. Place hold

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