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	1.	Thermal management handbook : for electronic assemblies / Jerry Sergent, Al Krum. by Sergent, Jerry E Krum, Al Series: Electronic packaging and interconnection series Material type: Text; Format: print Publication details: New York : McGraw-Hill, 1998 Availability: Items available for loan: UMK Kampus Jeli (1)Call number: TK7870.25 .S47 1998 OS. Place hold
	2.	Flexible printed circuitry / Thomas H. Stearns. by Stearns, Thomas H Series: Electronic packaging and interconnection series Material type: Text; Format: print Publication details: New York : McGraw-Hill, c1996 Availability: Items available for loan: UMK Kampus Bachok (1)Call number: TK7868.P7 S74 1996 OS. Place hold
	3.	Electronic assembly fabrication : chips, circuit boards, packages, and components / Charles A. Harper, editor-in-chief. by Harper, Charles A Series: Electronic packaging and interconnection series \| McGraw-Hill professional engineering Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2002 Availability: Items available for loan: UMK Kampus Bachok (1)Call number: TK7870 .E44 2002. Place hold

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