Polymeric Materials for Electronic Packaging / Shozo Nakamura
Publisher: Hoboken, New Jersey : John Wiley & Sons, Inc. , 2023Copyright date: @2023Description: xiii, 189 pages : illustrations ; 24 cmContent type:- text
- unmediated
- volume
- 9781394188796
- QD382 .C66 N35 2023
| Item type | Current library | Home library | Collection | Shelving location | Call number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|---|
Open Shelf
|
UMK Kampus Bachok | UMK Kampus Jeli | FBKT | Kampus Jeli Open Shelf Level 1 | QD382 .C66 N35 2023 (Browse shelf(Opens below)) | In Processing(Cataloging) | 10394305 | ||
|
Open Shelf
|
UMK Kampus Bachok | UMK Kampus Jeli | FBKT | Kampus Jeli Open Shelf Level 1 | QD382 .C66 N35 2023 (Browse shelf(Opens below)) | In Processing(Cataloging) | 10394306 |
Fakulti Biokejuruteraan Dan Teknologi (FBKT)
Includes bibliographical references and index
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