THERMAL FLUID-STRUCTURE INTERACTION ANALYSIS ON FLEXIBLE PRINTED CIRCUIT BOARD DURING REFLOW SOLDERING / MUHAMMAD IQBAL AHMAD; supervised by: Dr. Mohd Sharizal Abdul Aziz.
Material type:
TextProducer: 2021Description: xxvi, 210 pages: colour illustrations ; 30 cm + 1 computer discContent type: - text
- computer
- unmediated
- computer disc
- volume
| Item type | Current library | Home library | Collection | Shelving location | Call number | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|---|---|
Special Collection
|
UMK Kampus Jeli | UMK Kampus Jeli | FBKT | Kampus Jeli Special Collections Level 1 | TJ261 .M84 2021 tes (Browse shelf(Opens below)) | 1 | Available | 10373156 |
Thesis Collections.
Thesis PhD.
Bibliography : pages 177-210.
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