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Solder materials / Kwang-Lung Lin.

By: Material type: TextTextSeries: WSPC series in advanced integration and packaging ; 6 Publication details: Singapore : World Scientific Publishing Co. Pte. Ltd., 2018.Description: xi, 375 p. : ill. ; 24 cmISBN:
  • 9789813237605
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Holdings
Item type Current library Home library Collection Shelving location Call number Status Date due Barcode
Open Shelf Open Shelf UMK Kampus Bachok UMK Kampus Bachok FAE Kampus Bachok Open Shelf Level 1 TT267 .L56 2018 (Browse shelf(Opens below)) Available 10350029

Includes bibliographical references and index

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