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	1.	Advanced MEMS packaging / John H. Lau ... [et al.]. by Lau, John H Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2010 Other title: Advanced microelectromechanical systems packaging Availability: Items available for loan: UMK Kampus Jeli (2)Call number: TK7875 .A378 2010 OS, ... Place hold
	2.	Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials / John H. Lau ... [et al.]. by Lau, John H Series: McGraw-Hill handbooks Material type: Text; Format: print Publication details: New York, NY : McGraw-Hill, c2003 Availability: Items available for loan: UMK Kampus Bachok (1)Call number: TK7836 .E468 2003 OS. Place hold
	3.	Through-silicon Vias for 3d Integration / John H. Lau. by Lau, John H Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2013 Availability: Items available for loan: UMK Kampus Jeli (1)Call number: TK7874.893 .L38 2013. Place hold

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