Image from Google Jackets

Wire bonding in microelectronics / George G. Harmon.

By: Contributor(s): Material type: TextTextPublication details: New York : McGraw-Hill, c2010.Edition: 3rd edDescription: xx, 426 p. : ill. ; 24 cm. + 1 CD-ROM (4 3/4 in.)ISBN:
  • 9780071476232
Subject(s):
Tags from this library: No tags from this library for this title. Log in to add tags.
Star ratings
    Average rating: 0.0 (0 votes)
Holdings
Item type Current library Home library Collection Shelving location Call number Status Date due Barcode
Audio Visual Audio Visual UMK Kampus Bachok UMK Kampus Bachok FTKW Kampus Bachok Audio Visual Level 2 TK7836 .H366 2010 (Browse shelf(Opens below)) Available 10129884
Open Shelf Open Shelf UMK Kampus Bachok UMK Kampus Bachok GENERAL Kampus Bachok Open Shelf Level 1 TK7836 .H366 2010 (Browse shelf(Opens below)) Available 10033199
Open Shelf Open Shelf UMK Kampus Bachok UMK Kampus Bachok GENERAL Kampus Bachok Open Shelf Level 1 TK7836 .H366 2010 (Browse shelf(Opens below)) Available 10034232

Includes index

Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.

There are no comments on this title.

to post a comment.

©2025 Pustaka Universiti Malaysia Kelantan

THE OFFICE OF LIBRARY AND KNOWLEDGE MANAGEMENT