Results of search for 'ccl=su:"packaging."'

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	41.	Exploring package design / Chuck Groth by Groth, Chuck Material type: Text; Format: print ; Literary form: Not fiction Publication details: Clifton Park, NY : Thomson Delmar Learning, c2006 Availability: Items available for loan: UMK Kampus Bachok (2)Call number: TS195.4 .G76 2006, ... Place hold
	42.	What is packaging design? / Giles Calver ; editor: Leonie Taylor. by Calver, Giles [author.] Taylor, Leonie [author.] Series: Essential design handbooks Material type: Text; Format: print ; Literary form: Not fiction Publisher: Singapore : Page One, 2007Copyright date: ©2007 Availability: Items available for loan: UMK Kampus Bachok (1)Call number: NC1002 .P33 C35 2007 OS. Items available for reference: UMK Kampus Bachok: Not for loan (1)Call number: NC1002 .P33 C35 2007 REF. Place hold
	43.	Plastic packaging : interactions with food and pharmaceuticals by Piringer, Otto G [author.] Baner, Albert L [author.] Material type: Text; Format: print ; Literary form: Not fiction Publisher: USA, John Wiley & Sons 2008Copyright date: ©2008 Availability: Items available for reference: UMK Kampus Jeli: Not for loan (3)Call number: TP374 .P56 2008 REF, ...
	44.	Packaging design : successful product branding from concept to shelf / Marianne Rosner Klimchuk and Sandra A. Krasovec. by Klimchuk, Marianne Rosner [author.] Krasovec, Sandra A Material type: Text; Format: print ; Literary form: Not fiction Publisher: Hoboken, N.J. : J. Wiley & Sons, c2006 Availability: Items available for loan: UMK Kampus Bachok (4)Call number: TS195.4 .K65 2006 OS, ... Items available for reference: UMK Kampus Bachok: Not for loan (1)Call number: TS195.4 .K65 2006 REF. Place hold
	45.	Graphis packaging 8 : an international compilation of package design / publisher and creative Director, B. Martin Pedersen ; editor, Heinke Jenssen. Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : Graphis Press, c2000 Availability: Not available: UMK Kampus Kota: Damaged (1).
	46.	CD-art : innovation in CD packaging design / Charlotte Rivers by Rivers, Charlotte Edition: Rev. ed Material type: Text; Format: print ; Literary form: Not fiction Publication details: Mies, Switz. : RotoVision [2008] Availability: Items available for reference: UMK Kampus Bachok: Not for loan (1)Call number: NC1882 .R58 2008 REF.
	47.	Art from packaging : with projects using cardboard, plastics, foil, and tape / Gillian Chapman & Pam Robson. by Chapman, Gillian Robson, Pam Material type: Text; Format: print ; Literary form: Not fiction Publication details: London : Wayland, 1996 Availability: Items available for loan: UMK Kampus Bachok (1)Call number: TT160 .C49 1996 OS. Place hold
	48.	Packaging for nonthermal processing of food / edited by Jung H. Han. by Han, Jung H Series: IFT Press series Edition: 1st ed. Material type: Text; Format: print Publication details: Ames, Iowa : Blackwell Pub. : IFT Press, 2007 Availability: Items available for loan: UMK Kampus Jeli (1)Call number: TP374 .P328 2007 0S. Place hold
	49.	Packaging sustainability : tools, systems, and strategies for innovative package design / Wendy Jedlička ; with Elise L. Amel ... [et al.] ; additional contributions by Amelia McNamara ... [et al.]. by Jedlicka, Wendy, 1959- Material type: Text; Format: print Publication details: Hoboken, N.J. : John Wiley & Sons, c2009 Availability: Items available for loan: UMK Kampus Jeli (2)Call number: TS158 .J44 2009 OS, ... Place hold
	50.	Modified atmospheric processing and packaging of fish : filtered smokes, carbon monoxide, and reduced oxygen packaging / edited by W. Steven Otwell, Hordur G. Kristinsson, Murat O. Balaban by Balaban, Murat O Kristinsson, Hordur G Otwell, W. Steven Material type: Text; Format: print Publication details: Ames, Iowa : Blackwell Pub., 2006 Availability: Items available for loan: UMK Kampus Jeli (1)Call number: TP374 .M63 2006. Place hold
	51.	Advanced MEMS packaging / John H. Lau ... [et al.]. by Lau, John H Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2010 Other title: Advanced microelectromechanical systems packaging Availability: Items available for loan: UMK Kampus Jeli (2)Call number: TK7875 .A378 2010 OS, ... Place hold
	52.	Wire bonding in microelectronics / George G. Harmon. by Harman, George G Harman, George G. Reliability and yield problems of wire bonding in microelectronics Edition: 3rd ed. Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2010 Availability: Items available for loan: UMK Kampus Bachok (3)Call number: TK7836 .H366 2010 , ... Place hold
	53.	Quantum-well laser array packaging : nanoscale packaging techniques Jens W. Tomm, editor, Juan Jiménez by Jiménez, J. (Juan Tomm, Jens W Series: McGraw-Hill nanoscience and technology series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c2007 Availability: Items available for reference: UMK Kampus Jeli: Not for loan (1)Call number: QC176.8.Q35 Q36 2007 REF.
	54.	MEMS/MOEMS packaging : concepts, designs, metarials, and processes / Ken Gilleo. by Gilleo, Ken Series: McGraw-Hill nanoscience and technology series Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2005 Availability: Items available for loan: UMK Kampus Bachok (1)Call number: TK7870.15 .G55 2005 OS. Place hold
	55.	Thermal management handbook : for electronic assemblies / Jerry Sergent, Al Krum. by Sergent, Jerry E Krum, Al Series: Electronic packaging and interconnection series Material type: Text; Format: print Publication details: New York : McGraw-Hill, 1998 Availability: Items available for loan: UMK Kampus Jeli (1)Call number: TK7870.25 .S47 1998 OS. Place hold
	56.	Electronic packaging and interconnection handbook / Charles A. Harper. by Harper, Charles A Edition: 4th ed. Material type: Text; Format: print Publication details: New York : McGraw-Hill, 2005 Availability: Not available: UMK Kampus Jeli: In Transit (1).
	57.	Fundamentals of microsystems packaging / Rao R. Tummala, editor. by Tummala, Rao R, 1942- Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2001 Availability: Items available for reference: UMK Kampus Bachok: Not for loan (1)Call number: TK7870.15 .F86 2001 REF.
	58.	Area array package design : techniques in high-density electronics / Ken Gilleo, ed. by Gilleo, Ken Series: McGraw-Hill engineering reference guide series Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2004 Availability: Items available for reference: UMK Kampus Bachok: Not for loan (1)Call number: TK7870.15 .A74 2004 REF.
	59.	Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements / Charles Cohn, Charles A. Harper, [editors]. by Cohn, Charles Harper, Charles A Series: McGraw-Hill professional engineering Material type: Text; Format: print Publication details: New York : McGraw-Hill, c2005 Availability: Items available for loan: UMK Kampus Bachok (1)Call number: TK7870.15 .F353 2005 OS. Place hold
	60.	Innovations in food packaging / edited by Jung H. Han. by Han, Jung H Series: Food science and technology international series Material type: Text; Format: print Publication details: San Diego, Calif. : Oxford : Elsevier Academic ; Elsevier Science [distributor], 2005 Availability: Items available for loan: UMK Kampus Jeli (1)Call number: TP374 .I53 2005 OS. Place hold

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