TY  - BOOK
AU  - Gilleo,Ken
TI  - Area array packaging handbook
SN  - 9780071374934
PY  - 2002///
CY  - New York
PB  - McGraw-Hill
KW  - Ball grid array technology
KW  - Microelectronic packaging
N1  - Fakulti Teknologi Kreatif Dan Warisan; Includes bibliographical references and index
ER  -