TY  - BOOK
AU  - Harman,George G.
AU  - Harman,George G.
TI  - Wire bonding in microelectronics
SN  - 9780071476232
PY  - 2010///
CY  - New York
PB  - McGraw-Hill
KW  - Electronic packaging
KW  - Defects
KW  - Reliability
KW  - Wire bonding (Electronic packaging)
KW  - Production control
N1  - Includes index; Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989
ER  -