Lin, Kwang-Lung. <br/><br/>
Solder materials / 
Kwang-Lung Lin. 
 - Singapore :  World Scientific Publishing Co. Pte. Ltd.,  2018. 
 - xi, 375 p. :  ill. ;  24 cm. 
 - WSPC series in advanced integration and packaging ;  6    .
<br/><br/>Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9789813237605 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Solder and soldering. <br/>Solder pastes.