Thermal Management for Opto-Electronics Packaging and Applications / Xiaobing Luo, Run Hu, Bin Xie
Publisher: Hoboken, NJ : Wiley, 2024Copyright date: ©2024Description: xxii, 345 pages : illustrations (some color) ; 29 cmContent type:- text
- unmediated
- volume
- 9781119179276
- TK7870.25 .L86 2024
Item type | Current library | Home library | Collection | Shelving location | Call number | Status | Date due | Barcode | |
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UMK Kampus Jeli | UMK Kampus Jeli | FBKT | Kampus Jeli Open Shelf Level 1 | TK7870.25 .L86 2024 (Browse shelf(Opens below)) | Available | 10394103 | ||
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UMK Kampus Jeli | UMK Kampus Jeli | FBKT | Kampus Jeli Open Shelf Level 1 | TK7870.25 .L86 2024 (Browse shelf(Opens below)) | Available | 10394104 |
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TK7867.2 .A33 2024 PRINCIPLES OF ELECTROMAGNETIC COMPATIBILITY : Laboratory Exercises and Lectures / | TK7867.2 .A33 2024 PRINCIPLES OF ELECTROMAGNETIC COMPATIBILITY : Laboratory Exercises and Lectures / | TK7870.25 .L86 2024 Thermal Management for Opto-Electronics Packaging and Applications / | TK7870.25 .L86 2024 Thermal Management for Opto-Electronics Packaging and Applications / | TK7872 .D48 S63 2024 Smart Sensors for Industry 4.0 : Fundamentals, Fabrication and IIoT Applications / | TK7872 .D48 S63 2024 Smart Sensors for Industry 4.0 : Fundamentals, Fabrication and IIoT Applications / | TK9165 .L44 2025 Nuclear Reactor Physics and Engineering / |
Includes index.
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